| 型号/型号规格 | 分类 | 品牌 | 封装 | 批号 | 数量 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| L1N4007FT1G | 二极管 |
LRC/乐山 |
SOD-123 |
21+ |
36000 |
|||
| H5AG36EXNDX017 | IC |
SKHYNIX/海力士 |
BGA |
24+ |
200 |
|||
| INA215AIDCKR | IC |
TI/德州仪器 |
SC70-6 |
18+ |
12000 |
|||
| TLC6C5724QDAPRQ1 | LED驱动器 |
TI/德州仪器 |
HTSSOP38 |
22+ |
3545 |
|||
| A1333LLETR-5-T | 其他IC |
ALLEGRO/美国埃戈 |
TSSOP14 |
20+ |
2447 |
|||
| ZL30105QDG1 | 逻辑IC |
MICROSEMI/美高森美 |
TQFP64 |
23+ |
197 |
|||
| KMQ7X000SA-B315 | 内存芯片 |
SAMSUNG/三星 |
BGA |
15+ |
654 |
|||
| STM32F103VDT7 | 32位MCU |
ST/意法 |
LQFP100 |
22+ |
2160 |
|||
| TCAN1043ADRQ1 | IC |
TI/德州仪器 |
SOP-14 |
23+ |
2550 |
|||
| TK15A50D(STA4,X,M) | MOS(场效应管) |
进口TOSHIBA |
TO-220F |
20+22+ |
58900 |
|||
| A6641SETTR-T | 温度传感器 |
ALLEGRO/美国埃戈罗 |
QFN28 |
25+ |
11000 |
|||
| GD32F303CCT6 | 单片机MCU |
GD/兆易创新 |
LQFP-48 |
24+ |
420 |
|||
| MT41K128M16JT-125:K | IC |
MICRON/美光 |
BGA |
23+ |
900 |
|||
| H9HCNNNBKMMLXR-NEE | 存储IC |
SKHYNIX/海力士 |
BGA |
22+ |
73 |
|||
| LE9540DUQC | 其他被动元件 |
MICROSEMI/美高森美 |
QFN40 |
22+ |
2500 |
|||
| RT8509GQW | IC |
RICHTEK/立锜 |
WDFN-10L |
16+ |
4500 |
|||
| MT40A512M16LY-075:E | SDRAM存储器 |
MICRON/美光 |
BGA96 |
19+ |
100 |
|||
| MT53E1G32D2NP-046 WT:A | IC |
MICRON/美光 |
BGA |
21+ |
40 |
|||
| MIMX8MM6DVTLZAA | IC |
NXP/恩智浦 |
BGA |
19+ |
42 |
|||
| RK808-B | IC |
ROCKCHIP/瑞芯微 |
QFN68 |
19+ |
1210 |
|||
| PCM1681TPWPQ1 | 音频IC |
BURR-BROWN |
HTSSOP28 |
22+ |
604 |
|||
| C5750X7S2A106M230KB | 电容 |
TDK/东电化 |
SMD |
18+ |
3000 |
|||
| SDIN9DW4-64G | 内存芯片 |
SANDISK/闪迪 |
BGA |
15+ |
1812 |
|||
| K3QF6F60AM-QGCF |
|
存储IC |
SAMSUNG/三星 |
BGA |
16+ |
863 |
||
| K3RG2G20BM-MGCH | 存储IC |
SAMSUNG/三星 |
BGA |
15+ |
270 |
|||
| K3UH7H70AM-AGCL |
|
存储IC |
SAMSUNG/三星 |
BGA |
21+ |
545 |
||
| MT53D1024M32D4DT-053 AAT:D | 存储IC |
MICRON/美光 |
BGA |
20+ |
231 |
|||
| H26M64208EMR |
|
存储IC |
SKHYNIX/海力士 |
BGA |
17+ |
779 |
||
| 5M1270ZF256C5N | 单片机MCU |
ALTERA/阿尔特拉 |
BGA |
23+ |
237 |
|||
| MT53D1024M32D4DT-046 AIT:D | 存储IC |
MICRON/美光 |
BGA |
23+ |
59 |