| 型号/型号规格 | 分类 | 品牌 | 封装 | 批号 | 数量 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| TISP61089HDMR-S | IC |
BOURNS/伯恩斯 |
SOP8 |
21+ |
600 |
|||
| VC7916-62 | IC |
VANCHIP/唯捷创芯 |
QFN |
21+ |
2751 |
|||
| F280040CPMQR | IC |
TI/德州仪器 |
LQFP64 |
22+ |
188 |
|||
| 5M570ZF256C5N | IC |
ALTERA/阿尔特拉 |
BGA256 |
21+ |
319 |
|||
| MKL27Z256VMP4 | IC |
NXP/恩智浦 |
BGA |
21+ |
12800 |
|||
| A6270KLPTR-T-1 | IC |
ALLEGRO/美国埃戈罗 |
HTSOP16 |
22+ |
4000 |
|||
| PM-8009-1-WLNSP49D-TR-00-0 | IC |
QUALCOMM/高通 |
BGA |
21+ |
29548 |
|||
| 2EDL23N06PJ | IC |
INFINEON/英飞凌 |
SOP14 |
21+ |
239 |
|||
| KM5L9000CM-B424 | 存储IC |
SAMSUNG/三星 |
BGA |
23+ |
392 |
|||
| 74AUP1G09GW | IC |
NEXPERIA/安世 |
SOT353 |
23+ |
3000 |
|||
| 35TQS47MEU | 其他IC |
PANASONIC/松下 |
SMD |
21+ |
3545 |
|||
| QCA8075-0VV | IC |
QUALCOMM/高通 |
QFN |
21+ |
294 |
|||
| TXS0104EYZTR | IC |
TI/德州仪器 |
12DSBGA |
23+ |
801 |
|||
| K4F8E304HB-MGCJ | IC |
SAMSUNG/三星 |
BGA |
20+ |
88 |
|||
| 2N4391 | IC |
VISHAY/威世 |
TO-18 |
20+ |
6000 |
|||
| TEA1520T/N2 | 电源IC |
NXP/恩智浦 |
SOP-14P |
11+ |
2622 |
|||
| KLUCG2K1EA-B0C1 | 存储IC |
SAMSUNG/三星 |
BGA |
19+21+ |
158 |
|||
| S1MSWFQ-7 | 通用二极管 |
DIODES/美台 |
SOD-123F |
23+ |
3060 |
|||
| RTL8821AE | 通讯模块 |
MODULE |
MODULE |
23+ |
745 |
|||
| KMQ82000SM-B418 | 存储IC |
SAMSUNG/三星 |
BGA |
16+ |
2389 |
|||
| H9JKNNNFB3AECR-N6H |
|
IC |
SKHYNIX/海力士 |
BGA |
20+ |
833 |
||
| W971GG6SB-25 | 存储IC |
WINBOND/华邦 |
BGA |
19+ |
154 |
|||
| LM5122MHX/NOPB | IC |
TI/德州仪器 |
HTSSOP-20 |
18+ |
100 |
|||
| K4B4G1646E-BYK0 | 存储IC |
SAMSUNG/三星 |
BGA |
17+ |
244 |
|||
| KLUEG8UHDC-B0E1 |
|
存储IC |
SAMSUNG/三星 |
BGA |
21+ |
8685 |
||
| TPS7B8233QDGNRQ1 | 电源IC |
TI/德州仪器 |
HVSSOP8 |
22+ |
388 |
|||
| H9TQ17ABJTACUR-KUM |
|
存储IC |
SKHYNIX/海力士 |
BGA |
17+ |
428 |
||
| KMRX1000BM-B614 |
|
内存芯片 |
SAMSUNG/三星 |
BGA |
17+ |
748 |
||
| MT29VZZZCDAFQKWL-046 W.G0L | 存储IC |
MICRON/美光 |
BGA |
20+ |
50 |
|||
| LM61460AFSQRJRRQ1 | IC |
TI/德州仪器 |
VQFN-14 |
22+ |
1000 |