| 型号/型号规格 | 分类 | 品牌 | 封装 | 批号 | 数量 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| SDIN9DW4-64G | 内存芯片 |
SANDISK/闪迪 |
BGA |
15+ |
1812 |
|||
| K3QF6F60AM-QGCF |
|
存储IC |
SAMSUNG/三星 |
BGA |
16+ |
863 |
||
| K3RG2G20BM-MGCH | 存储IC |
SAMSUNG/三星 |
BGA |
15+ |
270 |
|||
| K3UH7H70AM-AGCL |
|
存储IC |
SAMSUNG/三星 |
BGA |
21+ |
545 |
||
| MT53D1024M32D4DT-053 AAT:D | 存储IC |
MICRON/美光 |
BGA |
20+ |
231 |
|||
| H26M64208EMR |
|
存储IC |
SKHYNIX/海力士 |
BGA |
17+ |
779 |
||
| 5M1270ZF256C5N | 单片机MCU |
ALTERA/阿尔特拉 |
BGA |
23+ |
237 |
|||
| MT53D1024M32D4DT-046 AIT:D | 存储IC |
MICRON/美光 |
BGA |
23+ |
59 |
|||
| K4F6E304HB-MGCH |
|
存储IC |
SAMSUNG/三星 |
BGA |
18+ |
450 |
||
| CDSOT23-SRV05-4 | IC |
BOURNS/伯恩斯 |
SOT23-6 |
19+ |
1139 |
|||
| K3KL3L30CM-BGCU | 存储IC |
SAMSUNG/三星 |
BGA |
23+ |
343 |
|||
| RK808-B | IC |
ROCKCHIP/瑞芯微 |
QFN68 |
19+ |
1210 |
|||
| TPD12S015AYFFR | IC |
TI/德州仪器 |
DSBGA28 |
21+ |
398 |
|||
| K4B4G1646E-BCNB | DDR存储器 |
SAMSUNG/三星 |
BGA |
21+ |
600 |
|||
| ACS724LMATR-20AB-T | IC |
ALLEGRO/美国埃戈罗 |
SOP16 |
22+ |
1544 |
|||
| BCM59121B0KMLG | IC |
BROADCOM/博通 |
QFN56 |
22+ |
240 |
|||
| C5750X7S2A106M230KB | 电容 |
TDK/东电化 |
SMD |
18+ |
3000 |
|||
| SI2319CDS-T1-GE3 | 中高压MOS管 |
VISHAY/威世 |
SOT-23 |
18+ |
2800 |
|||
| CAP1214-1-EZK-TR | IC |
MICROCHIP/微芯 |
VQFN32 |
22+ |
5600 |
|||
| MRF6VP3450H | MOS(场效应管) |
FREESCALE/飞思卡尔 |
NI-1230 |
12+ |
5 |
|||
| TPS54527DDAR | IC |
TI/德州仪器 |
SOP-8 |
18+ |
2500 |
|||
| MRFE6VP8600HR5 | 陶瓷电容 |
FREESCALE/飞思卡尔 |
NI-1230 |
13+ |
52 |
|||
| APQ-8009-0-504NSP-TR-01-1-AA | IC |
QUALCOMM/高通 |
BGA |
15+ |
2000 |
|||
| PCM1681TPWPQ1 | 音频IC |
BURR-BROWN |
HTSSOP28 |
22+ |
604 |
|||
| SAK-TC234LX-32F200F AB | 单片机MCU |
INFINEON/英飞凌 |
TQFP-144 |
23+ |
1732 |
|||
| KMDH6001DA-B422 |
|
存储器 |
SAMSUNG/三星 |
BGA |
19+ |
33 |
||
| TPS2065CDBVR | 开关IC |
TI/德州仪器 |
SOT23-5 |
19+ |
3028 |
|||
| MAX77812EWB+T | 电源IC |
MAXIM/美信 |
WLP-64 |
24+ |
6000 |
|||
| HV9861ALG-G | 驱动IC |
MICROCHIP/微芯 |
SOIC-8 |
23+ |
3500 |
|||
| GP801LSS9-13-71 | IC |
DIODES/美台 |
SOP-9 |
20+ |
6004 |