| 型号/型号规格 | 分类 | 品牌 | 封装 | 批号 | 数量 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| PDZVTFTR20B | IC |
ROHM/罗姆 |
SOD-128 |
22+ |
1500 |
|||
| LMR14050SQDPRRQ1 | 电源IC |
TI/德州仪器 |
WSON10 |
23+ |
3000 |
|||
| MXL661-AG-R | IC |
MAXLINEAR |
QFN24 |
21+ |
2500 |
|||
| TXS0104EYZTR | IC |
TI/德州仪器 |
12DSBGA |
23+ |
801 |
|||
| K4F8E304HB-MGCJ | IC |
SAMSUNG/三星 |
BGA |
20+ |
88 |
|||
| SII9687ACNUC | 接口IC |
LATTICE/莱迪斯 |
QFN76 |
19+ |
1600 |
|||
| RTL8821AE | 通讯模块 |
MODULE |
MODULE |
23+ |
745 |
|||
| ULN2003ADRG3 | IC |
TI/德州仪器 |
SOP16 |
10+ |
1034 |
|||
| HN8T05DEHKX073 | 存储IC |
SKHYNIX/海力士 |
BGA |
22+ |
30 |
|||
| KLUCG2K1EA-B0C1 | 存储IC |
SAMSUNG/三星 |
BGA |
19+ |
15 |
|||
| CD4010BM96 | 其他IC |
TI/德州仪器 |
SOP-16 |
16+ |
2096 |
|||
| ATMXT154-CUR | 其他IC |
ATMEL/爱特梅尔 |
BGA |
11+ |
6000 |
|||
| ICM-20628 | 其他IC |
INVENSENSE/应美盛 |
QFN |
14+ |
1000 |
|||
| K3LK3K30EM-BGCN | 存储IC |
SAMSUNG/三星 |
BGA496 |
20+ |
601 |
|||
| K4U6E3S4AA-MGCL |
|
存储IC |
SAMSUNG/三星 |
BGA |
19+ |
3225 |
||
| K4U6E3S4AM-MGCJ |
|
存储IC |
SAMSUNG/三星 |
BGA |
20+ |
7637 |
||
| MX25L6433FM2I-08G | FLASH存储器 |
MXIC/旺宏 |
SOP8 |
22+ |
1000 |
|||
| UCC28634DR | 运放IC |
TI/德州仪器 |
SOP7 |
19+ |
100 |
|||
| H9TQ26ACLTMCUR-KUM |
|
存储IC |
SKHYNIX/海力士 |
BGA |
17+ |
134 |
||
| SDINBDA4-64G | 存储IC |
SANDISK/闪迪 |
BGA |
21+ |
1109 |
|||
| AT24CM01-XHD-T | EEPROM存储器 |
MICROCHIP/微芯 |
TSSOP-8 |
18+ |
4587 |
|||
| NS10145T150MNV | 功率电感 |
TAIYO/太诱 |
SMD |
22+ |
240 |
|||
| OB2273MP | 电源IC |
ON-BRIGHT/昂宝 |
SOT23-6 |
22+ |
3000 |
|||
| K3UH5H50MM-AGCJ | 存储IC |
SAMSUNG/三星 |
BGA |
21+ |
1179 |
|||
| K3UH6H60BM-AGCL | 存储IC |
SAMSUNG/三星 |
BGA |
21+ |
2407 |
|||
| TAS5421QPWPRQ1 | IC |
TI/德州仪器 |
TSSOP16 |
22+ |
1300 |
|||
| A6270KLPTR-T-1 | IC |
ALLEGRO/美国埃戈罗 |
HTSOP16 |
22+ |
4000 |
|||
| MKL27Z256VMP4 | IC |
NXP/恩智浦 |
BGA |
21+ |
12800 |
|||
| SDINEDK4-256G | IC |
SANDISK/闪迪 |
BGA |
22+ |
600 |
|||
| H9JKNNNFB3AECR-N6H |
|
IC |
SKHYNIX/海力士 |
BGA |
21+ |
833 |